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Latest posts
Last updated about 11 hours ago
Benchmark For AI-Aided Chip Design That Evaluates LLMs Across 3 Critical Tasks (UCSD, Columbia)
about 11 hours ago
Researchers at UCSD and Columbia University published “ChipBench: A Next-Step Benchmark for...
Chip Industry Week In Review
1 day ago
Government moves The U.S. signed a non-binding letter of intent with USA...
Impact Of The Film Transfer And Grain Size On The Cu-barrier Properties Of 2D WS2 Films (NUS et al.)
1 day ago
A new technical paper titled “Enhancing Cu-barrier properties of 2D-WS2 barriers: The...
How The EDA Industry Will Evolve In 2026
2 days ago
AI will continue to impact every facet of the EDA industry. Pressure...
Opening The Door To STCO: Hierarchical Device Planning
2 days ago
By Todd Burkholder and Per Viklund The heterogeneous integration of multiple chiplets...
Does Your RISC-V Core Meet With The Standard?
2 days ago
Key Takeaways Architectural conformance and implementation verification are necessary but different for...
Building Trust At The Silicon Level: Secure Storage Solution For OTP IP
2 days ago
As semiconductor designs advance into cutting-edge nodes, the complexity of integrated IP...
Heterogeneous Multicore System IP
2 days ago
For many of today’s embedded applications, compute requirements demand multiple cores (compute...
Multi-Die Assemblies Require More Detailed Test Plan Earlier
2 days ago
Key Takeaways Design for test takes on new urgency in complex multi-die...
AI’s Impact On Engineering Jobs May Be Different Than Initial Projections
2 days ago
Key Takeaways AI is expected to eliminate many repetitive, entry-level tasks, but...
Autonomous Driving: Motion Planner Executed on Automotive-Grade Embedded HW (TU Munich)
2 days ago
A new technical paper titled “Towards Safe Autonomous Driving: A Real-Time Motion...
Ultra-low-bit LLM Inference Allows AI-PC CPUs And Discrete Client GPUs To Approach High-end GPU-Level (Intel)
3 days ago
A new technical paper titled “Pushing the Envelope of LLM Inference on...