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Latest posts
Last updated about 6 hours ago
3D Chips Push EDA Into New Territory
about 6 hours ago
Key Takeaways EDA tools are helping design 3D-ICs and multi-die systems by...
Autonomy Levels For Design Agents: L1 To L5 Explained
about 6 hours ago
Agentic AI plays an important role in chip and system design, but...
AI-Driven Device Modeling For Next Generation Quantum Applications
about 6 hours ago
Key takeaways Accelerate quantum system design by rapidly developing accurate device models...
EDA’s Future Is Evidence-Driven Automation
about 6 hours ago
Key Takeaways AI’s biggest EDA opportunity is workflow-level orchestration that coordinates tools,...
When AI Agents Cross Chip Design Silos
about 6 hours ago
Key Takeaways Chip design is moving toward specialized AI agents working together....
Managing 3D-IC Design And IP
about 6 hours ago
By Keith Felton and Todd Burkholder The trend towards multi-chiplet heterogeneous integration...
A Network-on-Chip (NoC) For Multi-Die Devices
about 6 hours ago
The semiconductor industry is rapidly transitioning from monolithic SoCs to chiplet-based architectures...
Blog Review: Sept. 23
1 day ago
Siemens’ Matteo Depaola and Robin Bornoff examine how physics-based digital twins for...
Make Your Interface Work For Your AI SoC—A 10 Step Program: Verification With Simulation
1 day ago
As AI SoCs integrate increasingly complex combinations of processors, accelerators, memory subsystems...
Building A Connected, Contextual Data Backbone For AI-Driven Semiconductor Design
1 day ago
Artificial Intelligence (AI) is redefining what’s possible in semiconductor design. From intelligent...
Multi-Agent AI Systems Must Work Like An Orchestra Without A Conductor
1 day ago
Key Takeaways: Multi-agentic systems have evolved into a dynamic, task-based organization of...
Build Secure SoCs From The Start
1 day ago
Modern semiconductor systems have reached unprecedented levels of complexity Today’s system-on-chip (SoC)...